The FINEPLACER® pico ma, a multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm.
This versatile platform is used in a wide field of micro assembly applications – such as flip chip and die bonding.
Designed for prototyping or low-volume production, R&D and universities.
- Placement accuracy 5 µm*
- Components from 0.125 mm x 0.125 mm to 100 mm x 100 mm*
- Working area up to 450 mm x 234 mm*
- Supports wafer/substrate sizes* up to 8" *
- Supports bonding forces up to 400 N*
- Can be configured as a hot air rework system
- Manual and semi-automatic configurations