The FINEPLACER^® pico ma, a multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm.

This versatile platform is used in a wide field of micro assembly applications – such as flip chip and die bonding.

Designed for prototyping or low-volume production, R&D and universities.

Highlights

• Placement accuracy 5 µm*
• Components from 0.125 mm x 0.125 mm to 100 mm x 100 mm*
• Working area up to 450 mm x 234 mm*
• Supports wafer/substrate sizes* up to 8" *
• Supports bonding forces up to 400 N*
• Can be configured as a hot air rework system
• Manual and semi-automatic configurations